(Corrects to delete extraneous phrase “for” in paragraph 3.)
By Hyunjoo Jin and Joyce Lee
SEOUL (Reuters) -Nvidia CEO Jensen Huang had requested reminiscence chip maker SK Hynix to carry ahead by six months the provision of its next-generation high-bandwidth reminiscence chips referred to as HBM4, SK Group Chairman Chey Tae-won mentioned on Monday.
South Korea’s SK Hynix mentioned in October that it aimed to provide the chips to clients within the second half of 2025. An SK Hynix spokesperson mentioned on Monday that this timeline was quicker than an preliminary goal with out elaborating additional.
Huang’s request for quicker supply highlights demand for greater capability, energy-efficient chips utilized in Nvidia (NASDAQ:)’s graphic processing models to develop AI expertise. Nvidia instructions greater than 80% of the worldwide AI chip market.
SK Hynix has been main a world race to satisfy an explosive demand for HBM chips that support within the processing of huge quantities of information to coach AI expertise and are essential for Nvidia’s chipsets. However it’s dealing with growing competitors from rivals like Samsung Electronics (KS:) and Micron (NASDAQ:).
SK Hynix, which plans to provide the newest 12-layer HBM3E to an unidentified buyer this 12 months, additionally plans to ship samples of extra superior 18-layer HBM3E early subsequent 12 months, its CEO, Kwak Noh-Jung, mentioned on the SK AI SUMMIT 2024 in Seoul.
Samsung mentioned final week that it was making progress on a provide take care of an unidentified main buyer after affected by delays, including that it was in talks with main clients to provide “improved” HBM3E merchandise within the first half of subsequent 12 months. Samsung additionally plans to provide the next-generation HBM4 merchandise within the second half of subsequent 12 months.
Shares of SK Hynix jumped 5.1% whereas Samsung shares firmed 1%. The broader market was up 1.6%.